Glass substrate packaging still lacks commercial adoption despite progress
Glass-core substrates, once touted as a replacement for organic packaging, are now in final qualification but have not appeared in any commercial product. SKC's Absolics plant is undergoing package-level reliability tests in Taiwan, with results possible before year-end. Samsung Electro-Mechanics has formed a joint venture targeting production in 2027, while Intel has shifted to licensing its patents.
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Original headline: “Glass substrate roadmaps examined — Absolics in final qualification and a first product that keeps slipping.” Browse more stories.