SK hynix starts construction of first US HBM assembly facility in Indiana
SK hynix held a groundbreaking ceremony for its HBM production base in West Lafayette, Indiana, which will focus on advanced packaging, testing, and R&D. The $4 billion facility is expected to open its cleanroom by October 2028 and begin volume production of next-generation HBM in the second half of 2029. The plant will package DRAM wafers made in South Korea, and is expected to employ around 1,000 people.
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Original headline: “SK hynix breaks ground on the first HBM plant in the US, bringing key AI component production to the States — says production starts in 2029.” Browse more stories.