SK hynix and Intel explore US HBM manufacturing partnership
SK hynix is reportedly in talks with Intel to begin memory chip manufacturing in the United States, potentially leasing space at Intel's Ohio One site or forming a joint venture with AI hyperscalers. This could mark the first HBM production facility in the US, complementing SK hynix's packaging plant in Indiana. Both companies have not confirmed the discussions, and South Korean government approval may be a hurdle.
SK hynix's potential US manufacturing move would complement its Indiana packaging facility, creating a fuller HBM production chain on American soil. The company's recent $26.5-billion Nasdaq listing provides financial flexibility for such expansion, while Intel's Ohio One site, slated to come online between 2030 and 2031, offers existing infrastructure.
The talks occur amid diplomatic pressure from both Washington and Seoul. The Commerce Department has threatened tariffs on South Korean and Taiwanese firms lacking US investment, while Seoul's $520-billion domestic chip plan and its $350-billion trade commitment to Washington create competing demands. SK Group chairperson Chey Tae-won signaled openness to US factories in July, though government approval remains uncertain.
A US-based HBM facility could reshape the global memory supply chain, potentially easing shortages for AI data centers that currently depend heavily on Asian manufacturing. American tech firms and hyperscalers would gain more reliable access to critical components, while South Korea faces a delicate balancing act between domestic industrial policy and US trade demands. Consumers may see more stable AI hardware pricing, though geopolitical tensions could complicate outcomes.