Startup raises $12M to scale ultra-thin chip materials for foundries
Nexstrom, a Singapore-based semiconductor startup, has secured $12 million in seed funding to develop equipment for manufacturing two-dimensional materials directly on commercial wafers. The company's North Star system targets 300mm wafers, aiming to address the challenge of producing these ultra-thin materials at industrial scale. Its technology builds on research from co-founder Lance Li, who previously worked on post-silicon electronics at TSMC.
Nexstrom's seed round brings its total funding to $15 million, with backing from Xora Innovation, Foothill Ventures, and SEEDS. The company's North Star system is designed for 300mm wafers, the industry standard in commercial chip fabrication, and its technology draws on co-founder Lance Li's prior work at TSMC on post-silicon electronics. The startup reports it has already scaled material growth from 2-inch to 6-inch wafers and expects to complete 8-inch capability by late October. Industry players including TSMC, Intel, and IMEC are pursuing similar 2D-material integration, while equipment makers like AIXTRON address other parts of the manufacturing chain. Nexstrom anticipates its equipment reaching commercial readiness between 2030 and 2035.
If Nexstrom's approach succeeds, it could help extend the trajectory of chip miniaturization beyond silicon's physical limits, potentially affecting everyone who relies on computing power—from data center operators to consumers of AI services. More efficient transistors could mean lower energy consumption and reduced heat in dense server environments, which may translate into cost savings and environmental benefits. However, the timeline to commercial production remains distant, and the company's impact will depend on whether foundries adopt its equipment and whether material quality can be consistently maintained at scale.