Qnity Launches High-Temperature Sealing Material for Chip Manufacturing
Qnity introduced Kalrez 7080 perfluoroelastomer parts for semiconductor processes that reach temperatures up to 330°C. The sealing material is designed to combine thermal resistance with very low outgassing and metallic contamination. It is aimed at diffusion, oxidation, thermal ALD, metal CVD, and LPCVD applications, and will be featured at SEMICON West.
Qnity, listed as NYSE: Q, says its new Kalrez 7080 seals target chipmaking steps that run as hot as 330°C. The parts are meant to resist heat while releasing few volatile compounds and little metal contamination. The company points to diffusion, oxidation, thermal ALD, metal CVD, and LPCVD as suitable uses.
In four-week air-aging tests at up to 325°C, Qnity reports the seals held up well. At SEMICON West in San Francisco from Oct. 13–15, it will also show Kalrez 9400 for plasma etch/strip, PF3 hardware-integrated components, and UPHT FFKM parts for ultra-pure plasma processes.
Better high-temperature seals could affect semiconductor fabs, equipment suppliers, maintenance teams, and eventually electronics users. If such parts reduce contamination and unplanned downtime, chip production may become more consistent, which could help availability of devices for computing, communications, vehicles, and health care. Workers might face fewer maintenance hazards if seals fail less often. These possibilities depend on adoption, cost, and real-world performance, so the broader social benefit remains uncertain.