GlobalFoundries lands $2B deal to make TSMC CoWoS interposers in New York
A new five-year pact worth $2 billion calls for GlobalFoundries to build silicon interposers used in TSMC's CoWoS advanced packaging. Production will be based at GlobalFoundries' Malta, New York fab, giving TSMC customers a U.S. source for these components. Ramping is planned for the first half of 2028.
Under a five-year, $2 billion agreement, GlobalFoundries will expand its Malta, New York facility to make silicon interposers for TSMC’s CoWoS-S packaging. These custom silicon pieces link logic chiplets with high-bandwidth memory stacks, supporting complex multi-die processors for AI and high-performance computing. Volume output is targeted for the first half of 2028.
Because interposer layouts vary by processor, they must match specific chiplet and HBM arrangements, power delivery, embedded deep trench capacitors, and thermal and signal needs. Very large designs may exceed reticle limits and require stitching. GF’s role is subcontract manufacturing rather than direct supply to TSMC, requiring alignment of design rules, processes, and qualification with TSMC’s packaging flows.
This could affect chip designers, AI/HPC hardware makers, and consumers by adding a U.S. packaging source, potentially easing supply bottlenecks and shortening some supply chains. Workers in Malta, New York may see expanded advanced-manufacturing jobs. If capacity ramps as planned, more AI and high-performance systems might reach market with greater geographic diversity, though costs, yields, and dependence on cross-company coordination may shape actual benefits.