Co-Packaged Optics Testing Struggles With Shifting Designs
Growing data-center deployments of near-packaged and co-packaged optics are forcing test suppliers to build high-volume manufacturing equipment. Because connector designs and laser sources are still evolving, and design-for-test is often absent, firms must check individual waveguides, resonators, or photodiodes—an approach that does not scale well. Optical parts are far more sensitive to small misalignments than electronic components, which makes thermal effects and warpage especially problematic.
NPO and CPO are appearing more often in large data-center construction, pushing test-equipment vendors toward high-volume production systems. Unlike earlier transceiver work, this scale requires many testers, robust software, data analysis, and test programming, not just lab-style rack instruments or custom alignment rigs.
Because connector architectures and laser sources remain unsettled, and design-for-test is often missing, suppliers may inspect each waveguide, resonator, or photodiode separately. Optical parts also tolerate tiny misalignments far less than electronic ones, so heat and warpage become major obstacles.
Advances in CPO testing could affect data-center operators, cloud and AI service providers, equipment makers, and ultimately users who depend on faster, more efficient data movement. If testing remains difficult to scale, deployment costs may stay higher or rollouts could slow, potentially delaying benefits for businesses and consumers. Test engineers and manufacturers may also need new skills and tooling as optical packaging moves toward mainstream production.