SUSS Enters Wafer Cleaning Market with GreenTec and GT200 System

SUSS MicroTec has introduced GreenTec Solutions, a new wafer-level cleaning product line, along with its first system, the GT200. The platform combines TurbulenStrip and CrustBuster technologies to remove resist and organic residues while cutting chemical use and avoiding hazardous acids. The GT200 targets 200 mm manufacturing for MEMS, RF, power devices, and CMOS, and SUSS sees the wafer-cleaning market as worth about €5.4 billion.

SUSS MicroTec is entering wafer-level cleaning with GreenTec Solutions. Its hybrid approach pairs TurbulenStrip, which uses batch soaking and single-wafer handling, with CrustBuster, which applies in-situ UV to remove organics at the wafer surface. The company cites an addressable market near €5.4 billion, driven by advanced packaging, heterogeneous integration, and AI/HPC demand.

The GT200 targets 200 mm MEMS, RF, power device, and CMOS work, spanning R&D, qualification, and production. SUSS plans a 300 mm high-volume platform in 2027 and a 200 mm HVM platform in 2028, giving customers a route from early evaluation toward volume output.