Intel moves ahead on Arizona and Ohio fabs, targets 2028 High-NA EUV output
Intel has started putting production equipment into Fab 62 in Arizona and gave an update on its Ohio fab project. The chipmaker confirmed that High-NA EUV lithography will be used for large-scale manufacturing in 2028. The moves are part of Intel's effort to grow advanced chip production capacity in the United States.
The report focuses on Intel’s U.S. manufacturing buildout, naming Arizona’s Fab 62 and the Ohio project as key sites. Intel has begun placing production tools at Fab 62 and shared a status update on Ohio. It also set 2028 as the point when High-NA EUV lithography would be used for large-scale manufacturing, linking the expansion to advanced chipmaking capacity in the United States. The supplied material does not include further technical, cost, or schedule details.
Intel’s Arizona and Ohio fab plans may affect local construction and technical workforces, equipment and material suppliers, and regional economies tied to semiconductor manufacturing. If High-NA EUV tools enter large-scale output in 2028, the timing could influence the supply and cost of advanced chips, with possible downstream effects for device makers and consumers. The scale of those effects remains uncertain from the available information.