Semiconductor Funding, Capacity, and AI Power Moves This Week

The U.S. Commerce Department proposed up to $389 million in semiconductor R&D support for four companies focused on power devices and critical materials, with the government set to receive minority nonvoting equity stakes. Nvidia broadened manufacturing supply agreements, including advanced packaging capacity in South Korea with Amkor. The roundup also covered Micron’s memory plans, Tenstorrent’s $1.5 billion raise, Chinese NAND fabs, 800V power for AI data centers, Intel’s Arizona fab progress, and more than $35 billion in Chinese orders for Nvidia GPUs.

Commerce issued letters of intent for up to $389 million in chip R&D aid to four recipients, proposing minority nonvoting government equity stakes. Helion may get $175 million for high-voltage fusion power semiconductors; Commonwealth Fusion Systems $85 million for RF plasma heating and related electronics; Vertical Semiconductor $73 million for vertical GaN transistors; Sibelco North America $56 million for ultra-high-purity quartz purification.

Nvidia broadened supply pacts. Amkor will add advanced packaging in South Korea, raising combined Arizona–South Korea commitments to $3 billion and targeting over fourfold interposer wafer capacity by end-2028. SPIL, Samsung Electro-Mechanics, KYEC, IBIDEN, and Unimicron will expand optical-engine assembly, ABF substrates, U.S. testing, and package substrate output.