Mobble
Technology · Semiconductors · published 2026-08-24 · via Tom's Hardware

SK hynix delays hybrid bonding to HBM5, cites wafer-thickness limit for AI memory stacks

SK hynix's packaging engineering VP revealed at Hot Chips 2026 that hybrid bonding will not debut until HBM5, missing HBM4E. The constraint is a 775-micron total height cap for HBM cubes, matching the standard thickness of a 300mm logic wafer, forcing thinner dies and narrower gaps. The company will continue using its MR-MUF process through Nvidia's Rubin platform, and its iHBM cooling solution cannot be retrofitted to already-designed memory generations.

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This summary is AI-generated and original to Mobble; the linked article is the authoritative source. Original headline: “SK hynix pushes hybrid bonding HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia Rubin.” Browse more stories.