MobbleOpen in Mobble ⇢
Technology · Semiconductors · published 2026-10-14 · via Semiconductor Digest

SEMI Expands Advanced Packaging Push with Global Coalition

SEMI is giving advanced packaging a larger role at SEMICON West, including three days of related programming. The organization is building its Advanced Packaging and Heterogeneous Integration coalition to support precompetitive development, standards, and interoperability. Led by Beth Keser, the effort will bring APHI summits to SEMICON events worldwide, with 2027 stops planned across multiple regions.

Expanded Detail

EXPANDED:

SEMI has raised advanced packaging's profile at SEMICON West, adding three days of related sessions. Its APHI coalition,

Expanded detail and Context are AI-generated analysis; the linked article remains the authoritative source.
Read the full article at Semiconductor Digest →
Related stories
AMBA C2C Effort Aims to Unify Chiplet Connectivity · Semiconductors
This summary is Al-enhanced to contain extended analysis and broader social context. The original is {NAME); the linked article is the authoritative source. Original headline: “SEMI Builds a Global Home for Advanced Packaging.” Browse more stories.