AMBA C2C Effort Aims to Unify Chiplet Connectivity
A new AMBA C2C specification is being developed to unify how AMBA protocols, including AXI and CHI, connect across chiplets. It aims to support a broad range of chiplet use cases with scalable protocol subsets, interoperability, and flexible transport while preserving needed capabilities. The effort builds on AMBA CHI C2C momentum for coherent heterogeneous compute and superchips.
The effort extends earlier chip-to-chip work beyond coherent systems. AMBA CHI C2C, introduced in 2023, already lets implementations negotiate supported properties, so they can include only needed features while staying compatible across chiplet categories, suppliers, and future versions.
AMBA C2C targets adding memory, attaching I/O or accelerators, and heterogeneous designs. Protocol subsets would allow simpler AXI-based, non-coherent traffic alongside richer coherent functions, lowering complexity where full coherence is unnecessary.
A converged chiplet connectivity standard could affect chip designers, system builders, and cloud operators by making it easier to mix components from different suppliers. That may speed development and lower costs for AI, automotive, and communications hardware, potentially broadening access to advanced computing. It could also influence how future devices scale performance and power, though actual benefits depend on adoption and implementation choices.